Real-time V-I insight for demanding RF plasma tools.

Precision V-I Measurements for Plasma Processes

Engineered for RF-driven plasma applications, Bird’s BDS2 V-I measurement solution delivers real-time voltage, current, phase angle, and impedance across fundamental and harmonic and intermodulation frequencies.

With dynamic impedance tracking and time-synchronized measurement, it provides the visibility needed to optimize match tuning, detect process drift, and stabilize chamber conditions.

Built for the fab floor, it brings metrology-grade performance into live production—so you can control your RF process with clarity and confidence.

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Impedance Clarity Across Every Frequency

Unlike basic V-I probes, the BDS2 computes impedance, return loss, and reflection coefficient across fundamental, harmonic, and IMD components.

This enables fine-tuned process control and smarter fault diagnostics where traditional sensors fall short.

Total Signal Visibility in Real Time

The BDS2 doesn’t just measure forward and reflected power—it captures voltage, current, and phase angle simultaneously.

You get a complete, time-synchronized view of your RF signal at every relevant frequency—not just the fundamentals.

Seamless Integration Without Disruption

Bird’s custom-designed sensor heads are engineered to drop into the existing RF path without altering impedance characteristics or delivery geometry.

That means you get precision V-I measurements without changing your validated process recipes.

Where Precision V-I Measurements Make the Difference

RF-powered plasma processes are complex, and small variations in voltage, current, phase, or impedance can lead to major deviations in tool performance, yield, or reliability. From chamber matching to endpoint detection, the BDS2 gives engineers the data they need to monitor, optimize, and control critical process variables—in real time, at the point where RF meets plasma.

Explore where V-I probes like the BDS2 provide measurable impact:

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Etch & Deposition Endpoint Detection

Track phase shifts and harmonic behavior to detect layer transitions and process completion—non-invasively and in real time.

Plasma Arc Detection & Characterization

Detect arc events through transient RF signatures—protecting hardware and reducing unplanned downtime by catching faults early.

Low Open Area Endpoint Detection

Enable reliable endpoint control in low open area features, where traditional optical and pressure-based techniques may fail—by monitoring subtle RF signature changes.

Pulsed RF Process Optimization

Resolve transient pulse behavior with microsecond-level resolution—allowing fine control over duty cycle, rise/fall times, and match performance in pulsed RF recipes.

Chamber Clean Verification

Confirm chamber cleaning effectiveness by analyzing pre/post-clean RF characteristics—ensuring plasma uniformity is restored and processes remain stable.

Ion Flux & Energy Trend Analysis

Use time-resolved V-I behavior to correlate plasma density and ion flux—key for understanding etch rates, selectivity, and uniformity.

Plasma Dicing Process Control

Monitor V-I and impedance data to maintain stable plasma conditions during wafer singulation—ensuring precise cuts and minimizing substrate damage in plasma dicing applications.

Chamber-to-Chamber Matching

Ensure consistent RF delivery across process tools by comparing voltage, current, phase, and impedance—critical for tool matching and fleet-wide uniformity.

Plasma Ignition Detection & Control

Track voltage and current behavior at plasma ignition to optimize matching network presets, ensure fast strike times, and prevent ignition failure.

Matching Network Health Monitoring

Identify component degradation or mismatch issues through real-time impedance tracking and phase angle analysis.

BDS2 Feature Summary

Feature

Parameters Measured

Simultaneously captures voltage, current, and phase angle in real time—up to 252 MHz. Calculates Power and Impedance.

Provides a full view of RF signal behavior—essential for impedance tracking and chamber diagnostics.

Multi-Frequency Monitoring

Simultaneously measures up to:
- 3 fundamental frequencies
- 4 harmonics per fundamental frequency
- 6 intermodulation products per fundamental frequency

Supports complex RF applications with multi-frequency generators, process optimization, chamber fingerprinting

Measurement Accuracy

Provides voltage, current and phase readings with ±1% accuracy across calibrated ranges

Delivers high-confidence measurements suitable for process qualification, tool matching, and control.

Real-Time Complex Impedance Calculation

Continuously computes impedance (magnitude and phase), reflection coefficient, and return loss

Crucial for match tuning, process optimization, and maintaining stable plasma conditions

Pulsed RF Mode

Supports time-resolved mode with 1 µs (500 ns) resolution

Excellent for pulsed measurement, with added multi-frequency flexibility

Frequency Slew Rate

Tracks RF frequency changes with high speed and stability (up to 2 GHz/sec)

Ensures accurate measurement of agile frequency generators

Time Domain Mode

Displays time-resolved V-I-phase data with 500 ns resolution

Enables detailed pulse shape analysis, transient response tuning, and insight into pulsed plasma behavior in a non-50 ohm environment.

Spectral Search Mode

Identifies active frequency components within the RF spectrum, similar to a spectrum analyzer

Useful for process fingerprinting, harmonic analysis, and plasma condition monitoring

Arc Detection

Detects sudden transients or phase/current anomalies that indicate arcing events with a real-time detection algorithm and configurable thresholds

Allows early fault detection, prevents wafer loss by identifying arcs early, and reduces unplanned downtime

Integration & Form Factor

- Customized sensor heads
- Sensor heads with QC connectors
- Sensor heads with protruding dielectric

Seamless integration—minimizing disruption to validated processes.

SCPI Automation Interface

Supports remote control and data logging via standard SCPI commands.

Enables integration into factory automation systems, data acquisition tools, and custom scripts.

NIST-Traceable Calibration

Factory-calibrated to national standards across supported frequencies

Provides confidence in measurement traceability for regulated and high-yield manufacturing

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Built to Capture the
Full RF Signal Spectrum

From sensor to receiver, every component is engineered for high-fidelity V-I and phase measurements—right where plasma and RF meet.

BDS2 V-I System

7001A500 family

System consists of a precision V-I sensor head, a compact RF receiver module, and a high-integrity sensor-to-receiver cable assembly.

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V-I Sensor with Connectors

7001A550-1-xxyy

The inline sensor with QC connectors captures real-time voltage, current, and phase data directly from the RF path with minimal impact on impedance or RF power delivery.

xx=input connector, yy=output connector

V-I Sensor with Protruding Dielectric

7001A550-1-2

This sensor is ideal for installations that require a copper strap or other non-coaxial setups. Sensor captures real-time voltage, current, and phase data directly from the RF path with minimal impact on impedance or RF power delivery.

BDS2 Receiver

7001A900-2

The receiver processes the RF signals across fundamental, harmonic and intermodulation frequencies, enabling accurate calculation of power, impedance, and related metrics.

Calibrated Cable Assembly

7001B040-5M

The cable is optimized for phase stability and shielding to preserve signal fidelity between sensor and receiver—ensuring reliable, high-speed data acquisition in demanding plasma environments.

BDS2 for AMAT Producer CVD Systems

7001A660 Sensor

P-CVD system consists of a custom-designed drop-in V-I sensor for Applied Materials Producer CVD tools, a compact RF receiver module and a high-integrity sensor-to-receiver cable assembly.

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What's at Stake

If you can’t see the problem, you can’t solve it.

In RF-driven manufacturing processes—like plasma etch, deposition, and plasma dicing—unseen signal distortion or impedance drift can silently degrade performance, reduce yield, or trigger tool variability.

Basic power sensors only tell part of the story. Without full visibility into voltage, current, phase, and impedance—across all relevant frequencies—you risk flying blind. The cost? Wasted wafers, failed processes, and delayed diagnostics.

The Bird BDS2 delivers the clarity needed to troubleshoot confidently, optimize aggressively, and prevent issues before they impact production.

FAQs

Have more questions? Get Expert Help>

What's the difference between the BDS2 with components purchased individually versus the kit?

How often should I calibrate my RF sensors?

Why is traceability important in RF power measurement?

The Measurement System That Fabs Trust

Bird's BDS2 has up to ±1% accuracy for V and I measurements into complex impedances, with NIST-traceable calibration and proven reliability in demanding fab environments. Combined with the experience of designing custom sensors to mate with new and existing applications, Bird offers a proven solution to manage process stability as technologies evolve.

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Need a Recalibration? We've Got You Covered

Keeping your RF sensor accurate is simple with the Bird Service Center. Just use the link below —quick, simple, and handled by the experts who know your gear best. We'll get your sensor back in action fast, with the confidence you can count on.

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Precision V-I Measurements for Plasma Processes

Impedance Clarity Across Every Frequency

Total Signal Visibility in Real Time

Seamless Integration Without Disruption